COMMITTEES

Organizing Committee

Tetsuya Yamamoto, Kochi University of Technology, Japan, Chair

Kenji Shiojima, University of Fukui, Japan, Co-Vice Chair

Atsuhiro Tsukune, Taiyo Nippon Sanso Corp., Co-Vice Chair

Shun-ichiro Ohmi, Tokyo Institute of Technology, Japan

Katsunori Makihara, Nagoya University, Japan

Koji Kita, The University of Tokyo, Japan

Steering Committee

Osamu Nakatsuka, Nagoya University, Japan, Chair

Katsunori Makihara, Nagoya University, Japan, Co-Vice Chair

Koji Kita, The University of Tokyo, Japan, Co-Vice Chair

Masashi Kurosawa, Nagoya University, Japan

Shigehisa Shibayama, Nagoya University, Japan

International Technical Program Committee

Kenji Shiojima, University of Fukui, Japan, Chair

Hiroyuki Fujimori, GlobalWafers Japan Co., Ltd., Japan, Co-vice Chair

Valentin Craciun, National Institute for Laser, Plasma, and Radiation, Romania, Co-vice Chair

Akihiro Wakahara, Toyohashi University of Technology, Japan

Akira Sakai, Osaka University, Japan

Akira Yamada, Tokyo Institute of Technology, Japan

Antonio Abate, Helmholtz Center Berlin for Materials and Energy, Germany

Atsushi Oshiyama, Nagoya University, Japan

Chee-Wee Liu, National Taiwan University, Taiwan

Detlev Gruetzmacher, Jülich Research Centre, Germany

Douglas J. Paul, University of Glasgow, The United Kingdom.

Eiji Kamiyama, GlobalWafers Japan Co., Ltd., Japan

Florencio Sanchez, Instituto de Ciencia de Materiales de Barcelona, ICMAB-CSIC, Spain

Fumihiko Hirose, Yamagata University, Japan

Fumimasa Horikiri, SCIOCS Co., Ltd., Japan

Gudrun Kissinger, IHP – Leibniz Institute for High Performance Microelectronics, Germany

Guus Rijnders, University of Twente, Netherlands

Hirokazu Tatsuoka, Shizuoka University, Japan

Hiroyuki Kageshima, Shimane University, Japan

Hisao Makino, Kochi University of Technology, Japan

Hitoshi Tabata, The University of Tokyo, Japan

Jacobo Santamaría Sánchez-Barriga, Complutense University of Madrid, Spain

Katsuaki Tanabe, Kyoto University, Japan

Katsuhiko Nishiguchi, Nippon Telegraph and Telephone Corporation, Japan

Katsuhiro Kutsuki, Toyota Central R&D Labs., Inc., Japan

Kazuo Tsutsui, Tokyo Institute of Technology, Japan

Kenji Okada, Tower Partners Semiconductor Co., Ltd., Japan

Kenji Shiraishi, Nagoya University, Japan

Kiyoteru Kobayashi, Tokai University, Japan

Kohei Fujiwara, Tohoku University, Japan

Koji Sueoka, Okayama Prefectural University, Japan

Masakazu Sugiyama, The University of Tokyo, Japan

Masao Inoue, Renesas Electronics Corporation, Japan

Masaru Hori, Nagoya University, Japan

Masaru Kadoshima, KOKUSAI ELECTRIC CORPORATION, Japan

Mayumi Takeyama, Kitami Institute of Technology, Japan

Naho Itagaki, Kyushu University, Japan

Noboru Ohtani, Kwansei Gakuin University, Japan

Noritaka Usami, Nagoya University, Japan

Noriyuki Watanabe, NTT Advanced Technology Corporation, Japan

Qixin Guo, Saga University, Japan

Roger Loo, Interuniversity Microelectronics Centre, Belgium

Shin-ichi Takagi, The University of Tokyo, Japan

Stefano Chiussi, University of Vigo, Spain

Susumu Fukatsu, The University of Tokyo, Japan

Takashi Kita, Kobe University, Japan

Takashi Koida, National Institute of Advanced Industrial Science and Technology, Japan

Takashi Kondo, The University of Tokyo, Japan

Takashi Nakayama, Chiba University, Japan

Takashi Tokuda, Tokyo Institute of Technology, Japan

Tanemasa Asano, Kyushu University, Japan

Tetsuya Yamamoto, Kochi University of Technology, Japan

Tokuyuki Teraji, National Institute for Materials Science, Japan

Tomoyoshi Mishima, Hosei University, Japan

Tsunenobu Kimoto, Kyoto University, Japan

Wataru Saito, Kyushu University, Japan

Wenchang Yeh, Shimane University, Japan

Yasufumi Fujiwara, Osaka University, Japan

Yasuo Koide, National Institute for Materials Science, Japan

Yoshio Honda, Nagoya University, Japan

Yoshitaka Okada, The University of Tokyo, Japan

Yutaka Mera, Shiga University, Japan

Publications Committee

Taizoh Sadoh, Kyushu University, Japan, Chair

Kenji Shiojima, University of Fukui, Japan, Publisher

International Advisory Committee

Akio Hiraki, Osaka University, Japan, Chair

Akira Toriumi, The University of Tokyo, Japan

Bernd Tillack, IHP – Leibniz Institute for High Performance Microelectronics, Germany

Junichi Murota, Tohoku University, Japan

Seiichi Miyazaki, Nagoya University, Japan

Shigeaki Zaima, Meijyo University, Japan

Toshimichi Ito, Osaka University, Japan

Tsugunori Okumura, Tokyo Metropolitan Industrial Technology Research Institute, Japan

Ya-Hong Xie, UCLA Samueli School of Engineering, U.S.A.

Yukio Yasuda, Nagoya University, Japan