Special issue of MSSP

Authors of accepted abstracts are encouraged to submit their original papers on the significant part of their work presented at ISCSI-IX to the special issue of Materials Science in Semiconductor Processing, published by Elsevier.

https://www.journals.elsevier.com/materials-science-in-semiconductor-processing/

The submission site will open on August 1, 2022. The deadline of the paper submission is October 30, 2022.

Each paper will be published online soon after its acceptance by completing the review process.

To start the submission process, authors should sign in for the following site with your EVISE or Elsevier profile. After signing in please select the special issue name as “VSI:ISCSI-IX papers”.

https://www.editorialmanager.com/mssp/default1.aspx

Those who wish to submit to this special issue should read through the following instructions for preparing manuscripts. Note that the manuscript will be published after the usual reviewing process of MSSP.

The Guide for Authors is available at the following link:
http://www.elsevier.com/wps/find/journaldescription.cws_home/600849?generatepdf=true

The publication charges of all accepted articles in this special issue will be FREE. Authors also have the option to select Open Access on their individual articles with corresponding fees. (If you do not choose this option there is no publication charge) You can submit papers in related research fields to this special issue without presentation at the conference.

The accepted articles will be published as an article collection of ISCSI-IX special issue of MSSP. There will be no distribution of a CD or hard copy of a collection of the accepted articles as the ISCSI-IX special issue of MSSP. Instead, the accepted articles will be applied to a 6-month free online access to maximize the impact of the articles.